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芝加哥，2016年8月2日 - Littelfuse公司, the global leader in circuit protection, has introduced a series of low capacitance TVS Diode Arrays optimized for protecting electronic equipment that may experience destructive electrostatic discharges (ESDs). SP814x Series TVS Diode Arrays (SPA® Diodes) integrate four or six channels of ultra-low-capacitance rail-to-rail diodes and an additional zener diode to safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. Their extremely low loading capacitance (1.0pF typ. per I/O), lower series resistance than semiconductor-based devices, and fast response also makes them ideal for protecting electronics with high speed signal pins, such as HDMI2.0, USB3.0, USB2.0, and IEEE1394. Applications for the SP814x Series include LCD/PDP TVs, external storage, DVD/Blue-Ray players, desktops/servers, notebooks/tablets, set-top boxes, mobile phones, flash memory cards, and digital cameras. "The SP814x Series offers an economical alternative to semiconductor-based common-mode filters (CMFs), which although perceived to add value, they do not filter unwanted signals or noise fast enough, creating signal integrity problems," said Tim Micun, product manager for TVS Diode Arrays. "For most high-speed interfaces, using such CMF devices means overspecifying and overspending on circuit protection. Because they have the same compact footprint as CMF devices, SP814x Series TVS Diode Arrays are an easy, low-cost option that doesn't compromise ESD protection." SP814x Series TVS Diode Arrays offer these key benefits: • Low capacitance (1.0pF typ. per I/O) minimizes signal degradation or attenuation for high-speed data, giving engineers more signal margin in their designs • Low leakage current (25nA typ. at 5V) extends battery life and preserves signal integrity because excessive leakage can be seen as additive capacitance for a high-speed differential pair. • 增强的ESD能力（±22kV接触放电，±22kV空气放电），让制造商能够达到超出IEC标准最高等级的ESD保护性能，并应对大量其他威胁，确保产品在实际使用中的可靠性。 • Compact form factor (μDFN, JEDEC MO-229 packages) saves precious board space, simplifies the PCB layout, and enables protection in space-constrained applications like smartphones. The footprint is also the same as semiconductor-based CMFs, permitting through-package routing for ESD-only solutions.

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Provides robust protection from ESD for wireless and tablet computing devices